Wafer Testing
Wafer test is a process to check whether the function or performance of the device matches the design specification by probing the entire chip on the wafer using each IC exclusive tester. O/S Check, and whether the function is active or not. In this process, only the good Die is selected. Injection is performed on the surface of the chip, so that it is excluded in the subsequent assembly process. Most of these processes are done automatically by Auto Wafer Prober.
Produce Specification
Produce Specification | ||||
---|---|---|---|---|
Application | Vendor | Model | Specification | Remark |
(Pin mux, Pattern mux) | ||||
DDI | T6371(ND1) | 250MHz | ||
Advantest | T6372(ND2) | 437.5MHz | ||
T6373(ND3) | 437.5MHz | HSIF?: 1.25GHz, HSDR2 : 2.0GHz (When module is installed on prober card) |
||
T6391(ND4) | 1.25GHz | 2GHz (License) | ||
Yokogawa | TS670 | 80MHz | ||
ST6730A | 375MHz | |||
ST6731A | 375MHz | 1.25GHz(GSIO) |
Process Introduction