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Bump

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Bumping refers to a process of forming an external connection terminal (bump) having a size of 5 to 20 μm on a wafer AI pad such as Au or a solder. Bumps on Die surface can perform various functions. Providing electrical connection to the substrate, and heat transfer from the chip to the substrate to prevent heat dissipation, shorting, and physically supporting the chip.
Produce Specification
Produce Specification
Item Capability
Wafer 8 inch
Hardness Middle Level : 60±20um
High Level : 90±20um
Bump Height (Typical) 8 ~ 14um
Height Uniformity WID : ≤2um
WIW : ±2um
Bump Pitch Straight 21um, Staggered 13um
AOI 2D

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