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COF (Chip on Film) is a type of Tape Automated Bonding (TAB) developed in the United States as an alternative to wire bonding. It connects the chip and the film, which serves as a substrate, to exchange signals with external electronic components. It is mainly applied to TV, Monitor, Notebook, etc. Recently, it has been applied to high performance display products such as Automotive and Smartphone, and has the following characteristics.
  • 1Fine Pitch
  • 2High I/O Counts
  • 3Low Profile(Thin, Flexible) & Low Weight
  • 4Reliability
Since 2004, LBLusem has been committed to continuous development of COF package technology. Currently, we offer various solutions for customer's requirements such as 2 Metal, Tape Attach, Thermal Reduce and SMT COF.
  • <2 Metal COF >
  • < Tape Attach >
  • < Thermal Reduce >
  • < SMT COF >


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